ABOUT US Ching Yi Technology Pte Ltd was established in 1989 and moving with market demand, we provide Precision Engineered Mechanical Solutions for Semicon leaders who appreciate the needs for new technologies in BGA, CSP, SiP, COB, SoB and myriads of associated enhancements in the Semicon manufacturing process.
Window Clampers Wire bond window clamps for use in wire bonding process to hold lead-frame and substrate securely in place
Dispensing Needles Dispensing Needles used in die attach process for dispensing epoxy
Pepper Pots & Needle Holders Die ejector tools in the form of pepper pots and needle holders used to eject dice from wafer tape during die attach
High Temp & Rubber Pickup Tools High Temp/Rubber Tips and Tip Holders used in various pick applications come in many shapes and sizes
Test Sockets Test sockets/contactors used in testing of device
Jigs, Fixtures & Toolings Customised Precision Solutions provide unparalleled customisation to suit your needs
WHY US Quality
Uncompromised Precision Dimensional & Concentric tolerance up to +/-0.005mm
Precision to match demands of Semicon manufacturing Customisable Design, prototype & develop for demanding applications Material Engineering Material & Surface Coat for improved durability Support Singapore Malaysia Thailand Philippines Indonesia
China Japan Korea Taiwan USA Europe and more...
FEATURES - Excellent customer support and unsurpassed quality
- Unparalleled re-engineering and innovation
- Customisation to suit your requirements
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