Precision Engineered Mechanical Solutions
Ching Yi Technology Pte Ltd was established in 1989 and moving with market demand, we provide Precision Engineered Mechanical Solutions for Semicon leaders who appreciate the needs for new technologies in BGA, CSP, SiP, COB, SoB and myriads of associated enhancements in the Semicon manufacturing process.
Products & Services
• SMT Pick & Place Nozzles and Tools
• Dispensing Needles
• Precision Engineering & Manufacturing Services (Customised Precision Solution)
• Semicon Toolings, Jig & Fixtures, Consumable Parts, Accessories
Window Clampers
Wire bond window clamps for use in wire bonding process to hold lead-frame and substrate securely in place
Dispensing Needles
Dispensing Needles used in die attach process for dispensing epoxy
Pepper Pots & Needle Holders
Die ejector tools in the form of pepper pots and needle holders used to eject dice from wafer tape during die attach
High Temp & Rubber Pickup Tools
High Temp/Rubber Tips and Tip Holders used in various pick applications come in many shapes and sizes
Jigs, Fixtures & Toolings
Customised Precision Solutions provide unparalleled customisation to suit your needs
Test Sockets
Test sockets/contactors used in testing of device
FEATURES
– Excellent customer support and unsurpassed quality
– Unparalleled re-engineering and innovation
– Customisation to suit your requirements
PROJECT MISSION
