Ching Yi Technology Pte Ltd is an “Extensive Inventory and Process Innovation” company with almost 30 years of experience in manufacturing and exporting nozzles. We specialise in nozzles for 0201” chip to large-scale components such as Ball Grid Array (BGA), Chip Scale Package (CSP), Quad Flat Package (QFP), connectors and various odd shape components.
For users of
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– Surface Coating for increased hardness, wear resistance and durability with
PVD/ DLC Diamond coating or general TiN coating.
– Nozzle Tip “Super High Toughness” is achieved by applying Polycrystalline Diamond
(PCD), Carbide, Vespel, Torlon, Ceramic, engineering plastic, etc.
– Heat treated steel for all applicable parts.